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7202 is a multi-purpose, two-component, room-temperature curing, high-strength liquid epoxy adhesive. This product can provide high-strength bonds to a variety of materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics, and other materials. It is also suitable for products requiring sealing and waterproofing. This product is suitable for electronic component assembly and industrial applications requiring structural bonding.
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7009 is a multi-purpose, two-component, room-temperature curing, high-strength liquid epoxy adhesive. This product can provide high-strength bonds to a variety of materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics, and others. It is also suitable for products requiring sealing and waterproofing. This product is ideal for electronic component assembly and industrial applications requiring structural bonding.
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7008 is a multi-purpose, two-component, room-temperature curing, high-strength liquid epoxy adhesive. This product can provide high-strength bonds to a variety of materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics, and others. It is also suitable for products requiring sealing and waterproofing. This product is ideal for electronic component assembly and industrial applications requiring structural bonding.
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7301 is a multi-purpose, two-component, room temperature or low temperature curing, high-strength liquid epoxy adhesive. This product can provide high-strength bonds to a variety of materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics, and other materials. It is suitable for optical products.
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A multi-purpose, two-component, high-strength liquid epoxy adhesive. This product is suitable for industrial applications requiring structural adhesives, such as semiconductors, optical fibers, and medical applications.
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74517D (G-7) is a two-component, thermally conductive epoxy adhesive that enables rapid positioning and reduces product displacement. This product features high bond strength, high thixotropy, and accelerated curing with additional heating. It is particularly suitable for the thermal encapsulation needs of electronic products such as chips.
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Tel:0755-29604659
Web:www.mosonbond.com
E-mail:moson@mosonbond.com
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Address: 5th Floor, Building C, No. 76, Dasha Road, Dalingshan Town, Dongguan City, Guangdong Province
Address: 2nd Floor, Building 1, No. 112, West District, Ma'anshan Community, Shajing Street, Bao'an District, Shenzhen
Address: Room 2806B, Building 2, Vanke Xingcheng Commercial Center, Shangxing Road, Shangxing Community, Xinqiao Street, Bao'an District, Shenzhen
