7387 is a one-component, low-viscosity CSP/BGA underfill adhesive. After curing, this material provides excellent protection for welded components in equipment against mechanical and thermal stresses such as impacts, drops, and vibrations.
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71173 is a one-component epoxy adhesive designed to provide uniform, void-free underfill encapsulation, maximizing device temperature cycling tolerance and dispersing stress away from solder joints, thereby significantly improving solder joint reliability in chip-scale packages (CSPs) and ball grid array packages (BGAs).
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7386-1 is a one-component, low-viscosity CSP/BGA underfill adhesive. After curing, this material provides excellent protection for welded parts in equipment when subjected to mechanical and thermal stresses such as impacts, drops, and vibrations.
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7386-2 is a one-component, low-viscosity, repairable CSP/BGA underfill adhesive. After curing, this material provides excellent protection for welded components in equipment against mechanical and thermal stresses such as impacts, drops, and vibrations.
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7386 is a one-component, low-viscosity, repairable CSP/BGA underfill adhesive. After curing, this material provides excellent protection for welded components in equipment against mechanical and thermal stresses such as impacts, drops, and vibrations.
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