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7329C is a multi-purpose, one-component, low-temperature thermosetting, high-strength liquid epoxy adhesive.This product can achieve high-strength bonding on various materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics and other materials.It is especially suitable for bonding heat-sensitive substrates that require low-temperature curing.It is ideal for electronic component assembly and industrial applications requiring structural bonding.
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7329 is a multi-purpose, one-component, low-temperature thermosetting, high-strength liquid epoxy adhesive.This product can achieve high-strength bonding on various materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics and other materials.It is especially suitable for bonding heat-sensitive substrates requiring low-temperature curing.It is ideal for electronic component assembly and industrial applications requiring structural adhesive bonding.
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Low-temperature thermosetting adhesives specifically refer to thermosetting adhesives that undergo cross-linking reactions upon heating at ≤100°C to form a three-dimensional network structure.They are mainly based on one-component epoxy systems, and formula optimization enables low-temperature and rapid curing, avoiding thermal damage to substrates.During curing, the resin reacts with latent curing agents at the set temperature, achieving stable bonding strength within a short time.
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7329D2 is a one-component, low-temperature thermosetting paste epoxy adhesive.This product can achieve high-strength bonding on various materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics and other materials.It is suitable for bonding heat-sensitive substrates that require low-temperature curing.This product features high thixotropy, easy shaping, and good toughness after curing.
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7329W is a multi-purpose, one-component, low-temperature thermosetting, high-strength liquid epoxy adhesive.This product can achieve high-strength bonding on various materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics and other materials.It is especially suitable for bonding heat-sensitive substrates that require low-temperature curing.It is ideal for electronic component assembly and industrial applications requiring structural bonding.
learn more
This is a multi-purpose, one-component, low-temperature thermosetting, high-strength liquid epoxy adhesive. It can provide high-strength bonds to a variety of materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics, and others. It is particularly suitable for bonding heat-sensitive substrates that require low-temperature curing. It is suitable for electronic component assembly and industrial applications requiring structural adhesives.
learn more
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Tel:0755-29604659
Web:www.mosonbond.com
E-mail:moson@mosonbond.com
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Address: 5th Floor, Building C, No. 76, Dasha Road, Dalingshan Town, Dongguan City, Guangdong Province
Address: 2nd Floor, Building 1, No. 112, West District, Ma'anshan Community, Shajing Street, Bao'an District, Shenzhen
Address: Room 2806B, Building 2, Vanke Xingcheng Commercial Center, Shangxing Road, Shangxing Community, Xinqiao Street, Bao'an District, Shenzhen
