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Two-component epoxy adhesive 74517D

74517D (G-7) is a two-component, thermally conductive epoxy adhesive that enables rapid positioning and reduces product displacement. This product features high bond strength, high thixotropy, and accelerated curing with additional heating. It is particularly suitable for the thermal encapsulation needs of electronic products such as chips.

Product Details

Model

74517D

Color

A: Black

B: White

After curing: Blackish blue

Hardness (HD)

80±5

Viscosity (mPa·s)

A: 140,000±30,000

B: 23,000±10,000

Density (g/cm³)

A: 1.65±0.02

B: 2.05±0.02

Mixed: 1.85

Water Absorption (%)

/

Shear Strength (MPa)

≥10

Curing Condition

80℃ for 3–20 min / Room temperature for 24 h

Storage

Room temperature / Dry condition

Typical Applications

PCB component bonding

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Henyao

Henyao

Henyao