| BGA Chip Underfill | EP7382 EP200907-1 EP7386 |
QFN Chip Small Component Encapsulation | EP7382 EP200907-1 EP7386 EP7452 7329L 191103-1 |
UV6108-3 Black UV180827-1 UV13523 UV6320 | |
| Module Board | Full Encapsulation Adhesive 7329R-1 9000-12 230513-3 200923-16 9000EN |
Half Encapsulation: Epoxy Thermosetting Adhesive 7329R UV Moisture-Curable 9100-2F UV Adhesive: Black 180827-1 Black 6109-2B Transparent 6108-3 Milky White 230327-1 Amber 13523 Dark Blue 220718-9 Transparent UV240416-3 UV6320 | |
| Shield Can Bonding | Low-Temperature Thermosetting Adhesive: 7329D2 Milky White 250512-7 7383 |
| FPC Solder Joint Protection | UV241111-1 |
| Single Component Coating | UV Moisture-Curable 240430-21 |
| Chip Four-Side Encapsulation | UV Moisture-Curable 9100-2F (with Fluorescence) |
| Chip Four-Corner Bonding Adhesive | Epoxy Thermosetting Adhesive 74516A |
| FR4 Filling | Low-Temperature Thermosetting Adhesive: 7329 |
| Mobile Phone Side Buttons | EP7382 EP7386 EP191103-1 UV220628-5 UV220628-6 |
| Chip Anti-Tamper Adhesive | 74516A |
电话:0755-27383451
电话:0755-29604659
网址:www.mosonbond.com
邮箱:moson@mosonbond.com
地址:深圳市宝安区沙井街道马安山社区西区112号1栋二层
...2026 版权所有 MOSON® 曼森 粤ICP备2026014052号 地址：深圳市宝安区沙井街道马安山社区西区112号1栋二层
地址：广东省东莞市大岭山镇大沙路76号科瑞鑫科技园C栋5层地址：深圳市宝安区新桥街道上星社区上星路万科星城商业中心2栋2806B
