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5946-1A is a fast-drying adhesive primarily used for bonding materials such as electronics, plastics, rubber, metals, leather, and mesh. It features low whitening, low odor, good flexibility, moisture resistance, and high strength.
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5499 instant adhesive is mainly used for bonding materials such as electronics, plastics, rubber, metals, leather, and mesh. It features low whitening, low odor, good flexibility, moisture resistance, and high strength.
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1813 is primarily used for structural bonding of materials such as metal-to-metal, aluminum-magnesium alloys, anodized aluminum, stainless steel, engineering plastics, composite materials, ceramics, and glass. The ratio of the binder to the hardener is 10:1, featuring simple operation, fast curing speed, and high strength. Excess adhesive is easily controlled, and it has good toughness. No primer or surface treatment is required for bonding metals. After curing, the product exhibits impact resistance and high-frequency vibration resistance. The product is RoHS compliant and meets export requirements to the EU and other regions.
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1815 is primarily used for structural bonding of materials such as metal-to-metal, aluminum-magnesium alloys, anodized aluminum, stainless steel, engineering plastics, composite materials, ceramics, and glass. The ratio of the binder to the hardener is 10:1, featuring simple operation, fast curing speed, and high strength. Excess adhesive is easily controlled, and it has good toughness. No primer or surface treatment is required for bonding metals. After curing, the product exhibits impact resistance and high-frequency vibration resistance. The product is RoHS compliant and meets export requirements to the EU and other regions.
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9100-2F is a one-component, highly thixotropic UV/moisture dual-curing adhesive. This product rapidly cures upon exposure to sufficiently strong UV/or visible light to form a tough, translucent adhesive layer, and also cures in the shade. It is primarily used for localized protection of WLCSP and BGA circuit boards. This product fluoresces when observed under UV light.
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9100-1 is a one-component, highly thixotropic UV/moisture dual-curing adhesive. This product rapidly cures upon exposure to sufficiently strong UV/or visible light to form a tough, translucent adhesive layer, and also cures in the shade. It is primarily used for localized protection of WLCSP and BGA circuit boards. This product fluoresces when observed under UV light.
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9100-2 is a one-component, highly thixotropic UV/moisture dual-curing adhesive. This product rapidly cures upon exposure to sufficiently strong UV/or visible light to form a tough, translucent adhesive layer, and also cures in the shade. It is primarily used for localized protection of WLCSP and BGA circuit boards. This product fluoresces when observed under UV light.
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This is a single-component UV and moisture-curing adhesive, primarily composed of imported UV and moisture-curing resins, activators, photoinitiators, and various additives. After curing, it forms a transparent, dense, and smooth protective film, exhibiting superior resistance to high and low temperatures, insulation, moisture resistance, leakage prevention, shock resistance, dust resistance, corrosion resistance, mildew resistance, and sulfurization resistance on PCB boards. It is environmentally friendly, safe, 100% solids content, and offers advantages such as ease of use and simple operation.
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Tel:0755-29604659
Web:www.mosonbond.com
E-mail:moson@mosonbond.com
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Address: 5th Floor, Building C, No. 76, Dasha Road, Dalingshan Town, Dongguan City, Guangdong Province
Address: 2nd Floor, Building 1, No. 112, West District, Ma'anshan Community, Shajing Street, Bao'an District, Shenzhen
Address: Room 2806B, Building 2, Vanke Xingcheng Commercial Center, Shangxing Road, Shangxing Community, Xinqiao Street, Bao'an District, Shenzhen
