Bottom filler 71173

Category:Bottom filler glue

71173 is a one-component epoxy adhesive designed to provide uniform, void-free underfill encapsulation, maximizing device temperature cycling tolerance and dispersing stress away from solder joints, thereby significantly improving solder joint reliability in chip-scale packages (CSPs) and ball grid array packages (BGAs).

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Product Details

Model

71173

Color

Black

Hardness (HD)

88±5

Viscosity (mPa·s)

13,300±2,000

Density (g/cm³)

1.65±0.02

Volume Shrinkage (%)

< 2

Glass Transition Temperature Tg (℃)

161

Water Absorption (%)

< 1

Shear Strength (MPa)

> 5

Curing Condition

150℃ for 5–10 min

Storage

-40℃ to -20℃

Typical Applications

Chip underfill / Low CTE / Especially for automotive chips, AI chips, etc.

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AA process adhesive for automotive cameras AA process adhesive for mobile phone cameras Single-component silicone Two-component silicone UV-heated dual-curing adhesive ...

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Chip filling adhesive solution Adhesive Solutions for Micro Switches Adhesive solution for fingerprint modules Optical communication adhesive solutions Adhesive Solutions for VR Headsets ...

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Contact Us

Tel:0755-27383451

Tel:0755-29604659

Web:www.mosonbond.com

E-mail:moson@mosonbond.com

Add:2nd Floor, Building 1, No. 112, West District, Ma'anshan Community, Shajing Subdistrict, Bao'an District, Shenzhen

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