Bottom filler 7386-2

Category:Bottom filler glue

7386-2 is a one-component, low-viscosity, repairable CSP/BGA underfill adhesive. After curing, this material provides excellent protection for welded components in equipment against mechanical and thermal stresses such as impacts, drops, and vibrations.

Online consultation Contact Us

Product Details

Model

7386-2

Color

Black

Hardness (HD)

85±5

Viscosity (mPa·s)

2700±500

Density (g/cm³)

1.14±0.02

Volume Shrinkage (%)

< 4

Glass Transition Temperature Tg (℃)

110

Water Absorption (%)

< 1

Shear Strength (MPa)

> 10

Curing Condition

120℃ for 20 min

Storage

2℃ to 8℃

Typical Applications

Chip underfill / Repairable

About us

Company Profile History Honor News Video Center ...

Product

AA process adhesive for automotive cameras AA process adhesive for mobile phone cameras Single-component silicone Two-component silicone UV-heated dual-curing adhesive ...

Industry

Chip filling adhesive solution Adhesive Solutions for Micro Switches Adhesive solution for fingerprint modules Optical communication adhesive solutions Adhesive Solutions for VR Headsets ...

Services

Company Profile History Honor News Video Center ...

Contact Us

Tel:0755-27383451

Tel:0755-29604659

Web:www.mosonbond.com

E-mail:moson@mosonbond.com

Add:2nd Floor, Building 1, No. 112, West District, Ma'anshan Community, Shajing Subdistrict, Bao'an District, Shenzhen

...

You might also like to know

2026 Copyright MOSON® 粤ICP备2026014052号

Address: 5th Floor, Building C, No. 76, Dasha Road, Dalingshan Town, Dongguan City, Guangdong Province

Address: 2nd Floor, Building 1, No. 112, West District, Ma'anshan Community, Shajing Street, Bao'an District, Shenzhen

Address: Room 2806B, Building 2, Vanke Xingcheng Commercial Center, Shangxing Road, Shangxing Community, Xinqiao Street, Bao'an District, Shenzhen