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7386 is a one-component, low-viscosity, repairable CSP/BGA underfill adhesive. After curing, this material provides excellent protection for welded components in equipment against mechanical and thermal stresses such as impacts, drops, and vibrations.
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Mobile camera AA process is a core packaging technology that achieves sub-micron optical alignment by dynamically adjusting the positions of the lens, sensor and other components through real-time image feedback.
It uses UV pre-curing within seconds to lock micron-level accuracy, and low-temperature heat curing to ensure long-term durability.
It combines high bonding strength, low shrinkage and excellent environmental resistance, making it the key material for assembling lens to lens holder, VCM motor and sensor in mobile camera modules.
7329D2 is a one-component, low-temperature thermosetting paste epoxy adhesive. This product can provide high-strength bonding to a variety of materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics, and others. It is suitable for bonding heat-sensitive substrates that require low-temperature curing. This product has high thixotropy, is easy to shape, and exhibits good toughness after curing.
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6201-1 is a one-component, UV-curable, acrylic adhesive. This product offers excellent bonding performance for PC, LCP, ABS, and nylon+glass fiber materials, as well as for protecting PCB components, IC components, FPC, ribbon cables, and solder joints. It features strong adhesion, toughness, and high shock resistance.
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The AA process for mobile phone cameras is a core packaging technology that dynamically adjusts the position of components such as lenses and sensors through real-time image feedback to achieve sub-micron level optical alignment. It uses second-level UV pre-curing to lock in micron-level precision and low-temperature thermal curing to achieve durability. It also takes into account high bonding strength, low shrinkage and excellent environmental resistance. It is the core material for assembling lenses-mounts, VCM motors and sensors in mobile phone camera modules.
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7329C is a multi-purpose, one-component, low-temperature thermosetting, high-strength liquid epoxy adhesive. This product can provide high-strength bonds to a variety of materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics, and others. It is particularly suitable for bonding heat-sensitive substrates that require low-temperature curing. It is suitable for electronic component assembly and industrial applications requiring structural adhesives.
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74519R is a multi-purpose, one-component, thermosetting, high-strength liquid epoxy adhesive. This product provides high-strength bonding to a variety of materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics, and others. It is particularly suitable for COB (Choose-O-Body) bonding.
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The AA process for mobile phone cameras is a core packaging technology that dynamically adjusts the position of components such as lenses and sensors through real-time image feedback to achieve sub-micron level optical alignment. It uses second-level UV pre-curing to lock in micron-level precision and low-temperature thermal curing to achieve durability. It also takes into account high bonding strength, low shrinkage and excellent environmental resistance. It is the core material for assembling lenses-mounts, VCM motors and sensors in mobile phone camera modules.
learn more
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Tel:0755-29604659
Web:www.mosonbond.com
E-mail:moson@mosonbond.com
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Address: 5th Floor, Building C, No. 76, Dasha Road, Dalingshan Town, Dongguan City, Guangdong Province
Address: 2nd Floor, Building 1, No. 112, West District, Ma'anshan Community, Shajing Street, Bao'an District, Shenzhen
Address: Room 2806B, Building 2, Vanke Xingcheng Commercial Center, Shangxing Road, Shangxing Community, Xinqiao Street, Bao'an District, Shenzhen