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74519R COB chip package for mobile phone cameras

74519R is a multi-purpose, one-component, thermosetting, high-strength liquid epoxy adhesive. This product provides high-strength bonding to a variety of materials in a short time, including metals, ceramics, glass, rubber, heat-resistant plastics, and others. It is particularly suitable for COB (Choose-O-Body) bonding.

Product Details

Model

74519R

Color

Red

Hardness (HD)

90±5

Viscosity (mPa·s)

20,000±10,000

Density (g/cm³)

1.15±0.02

Volume Shrinkage (%)

< 4

Glass Transition Temperature Tg (℃)

/

Water Absorption (%)

< 1

Shear Strength (MPa)

> 10

Curing Condition

120℃ for 30 min

Storage

-20℃ to -15℃

Typical Applications

Mobile phone camera / COB chip encapsulation

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Henyao

Henyao

Henyao