Low-temperature thermosetting adhesives refer to thermosetting adhesives that undergo cross-linking reaction under heating at ≤100℃ to form a three-dimensional network structure.They are mainly one-component epoxy systems, formulated to achieve rapid curing at low temperatures and avoid thermal damage to substrates.During curing, the resin and latent curing agent react at the set temperature and reach stable bonding strength within a short time.
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