车规级高可靠芯片封装底部填胶

产品介绍

在半导体芯片封装中，传统半导体封装底部填胶面临固化效率低、填充不充分、热机械应力失效、耐候性不足、工艺兼容性差等痛点问题。针对上述车规级芯片封装痛点，曼森成功研发出车规级高可靠半导体芯片封装底部填胶71173系列，专为BGA /CSP倒装芯片等器件设计，具有以下核心优势：

1. 快速固化：可在 150℃下5-10分钟完成固化，大幅提升产线效率；

2. 高可靠填充：具备超高流动性，可快速渗透至微小间隙（≤50μm），实现无空洞填充；

3. 低热膨胀系数：产品具有低CTE（30ppm/℃）,有效缓解 CTE失配引起的热机械应力，降低焊球开裂风险；

4. 车规级耐候：产品的Tg达162℃，优异的耐高低温循环耐冲击（-40℃~150℃），通过双85老化测试1000小时；

工艺兼容优良：兼容BGA/CSP倒装芯片封装工艺，对助焊剂残留不敏感；符合RoHS、REACH等环保标准，满足车规级绿色制造要求。

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